| PART |
Description |
Maker |
| FDS4080N7 |
RELAY, 4PCO, 12VDC; Configuration, contact:4PCO; Voltage, contact DC max:30V; Voltage, coil DC nom:12V; Current, contact AC max:5A; Current, contact DC max:5A; Voltage, contact AC max:250V; Resistance, coil:160R; Material, RoHS Compliant: Yes
40V N-Channel FLMP PowerTrench MOSFET
|
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
|
| T10C T10C110 T10C140 T10C180 T10C220 T10C270 T10C8 |
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE3 Point Connector Block 5B. 3端配置，比赛在应用程序插件GDT中引脚配置，适合在科龙⑩3点连接器5B条
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE⑩ 3 Point Connector Block 5B.
3 Terminal configuration matches G.D.T. pin configuration For Plug in Applications fits in KRONE 3 Point Connector Block 5B.
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE 3 Point Connector Block 5B.
SiBOD
|
Littelfuse, Inc.
LITTELFUSE[Littelfuse]
|
| T-31201 T-31202 |
Single Configuration / Dual Configuration
|
Rhombus Industries Inc.
|
| AT17LV020-10JC AT17LV020-10JI AT17LV020 AT17C020-1 |
10MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 2M X 1 CONFIGURATION MEMORY, PQCC20
2-megabit FPGA Configuration EEPROM Memory
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AT17F080 AT17F080-30BJC AT17F080-30BJI AT17F080-30 |
FPGA CONFIGURATION FLASH MEMORY 4M X 1 CONFIGURATION MEMORY, PQCC20
|
Atmel, Corp.
http://
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| XC1700D XC17128DDD8M XC17256DDD8M XC1736DDD8M XC17 |
From old datasheet system
QPRO Family of XC1700D QML Configuration PROMs QPRO家庭的PROM配置的XC1700D QML
QPRO Family of XC1700D QML Configuration PROMs 64K X 1 CONFIGURATION MEMORY, CDIP8
Cascadable for storing longer or multiple bitstreams
QPRO Family of XC1700D QML
|
http://
XILINX[Xilinx, Inc]
Xilinx, Inc.
Xilinx Inc
XILINX INC
|
| XC17V04-SERIES XC17V01-SERIES XC17V16-SERIES XC17V |
XC17V00 Series Configuration PROM XC17V00系列配置PROM
XC17V00 Series Configuration PROMs
|
Diodes, Inc.
Xilinx
|
| IRFK6J150 IRFK6H150 IRFK6H350 IRFK6J350 IRFK6JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION 隔震基电力六角巴基斯坦大会平行芯片配
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
100V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| XC18V512 XC18V01 |
In-System Programmable Configuration PROMs(在系统可编程配置PROM)
In-System Programmable Configuration PROMs(?ㄧ郴缁??缂????疆PROM)
|
Xilinx, Inc.
|
| MIP0210SP |
ISOLATOR 3P 25AISOLATOR 3P 25A; Poles, No. of:3; Current rating:25A; Configuration, contact:1 N/O 1 N/C; Depth, external:169mm; IP rating:IP55; Length / Height, external:174mm; Material:Steel; Power, switching AC3 max:5.5kW; Width,
Silicon MOS IC
|
PANASONIC CORP
Panasonic Semiconductor
|
| AT17F040A-30CU AT17F040A-30QI AT17F040A-30JU AT17F |
FPGA Configuration Flash Memory
30MHZ, 32 TQFP, COM TEMP(FPGA) 8M X 1 CONFIGURATION MEMORY, PQFP32
30MHZ, 32 TQFP, COM TEMP(FPGA) 4M X 1 CONFIGURATION MEMORY, PQFP32
|
http://
Atmel, Corp.
ATMEL Corporation
|
